BAKU BK-051G Soldering Paste

● It uses new technical support, the unique chemical formulations provide excellent wetting, ensuring high reliability.

● Efficient use of the thixotropic agent, can effectively prevent the collapse of the solder printing and special preheating the printing and to ensure good fine pattern.

● It uses more advanced insulation technology, tack lasting, so it is easy to dry, sticky and lasts more than 48 hours.

● High quality and unique formula, perfect performance, easy to weld, solder bright and full, no solder false phenomena.

● The residue was colorless and transparent, does not affect the excellent detection, disposable and cleaning performance.

● Product moist and good, strong anti-dry at room temperature shelf life longer, adapted to mobile phone repair industry, digital computer repair industry, high-precision circuit board SMT soldering, BGA soldering process.